导航

浏览

  • 首页
  • 中国国际半导体技术大会
  • 大讲堂
  • 招聘
首页 中国国际半导体技术大会 大讲堂 招聘
English
Richard Ali
  • 个人中心
  • Night mode
  • 退出
登录

账号密码登录

没有账号 去注册

找回密码

注册账号

已有账号 去登录

CSTIC预登记号登录

没有账号 去注册 账号密码登录

China Semiconductor Technology International Conference (CSTIC) 2022

中国国际半导体技术大会

China Semiconductor Technology International Conference (CSTIC) 2022

中国国际半导体技术大会

Virtual Conference Registration
  • Live Meeting Agenda
  • Conference Agenda
  • CSTIC 2023 Call for Papers
  • Introduction
  • Committees
  • Keynote Speakers
  • Training Courses
  • Symposiums
  • Sponsors

Introduction

Plan now to participate at CSTIC 2022, one of the largest and the most comprehensive annual semiconductor technology conferences in China and Asia since 2000. Organized by SEMI and IEEE-EDS, co-organized by IMECAS, CSTIC 2022 will be held on June 14-July 12, 2022 as a virtual conference on the SEMI Cloud. The conference will have nine symposiums covering all aspects of semiconductor technology with focus on manufacturing and advanced technology, including detailed manufacturing processes, device design, integration, materials, and equipment, as well as emerging semiconductor technologies, circuit design, and silicon material applications. Hot topics, such as artificial intelligence (AI) chips, 6G chips, neuromorphic computing technology, advanced memory technology, 3D integration, MEMS technology will also be addressed in the conference.

**Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore's scope and quality requirements.
Outstanding papers will be recommended for publication in a special issue of a reputable SCI-indexed journal.

Plenary Session

Committees More

  • Dr. Hanming Wu

    Conference Chair

  • Dr. Beichao Zhang

    Conference Executive Co-Chair

  • Prof. Ru Huang

    Conference Co-Chair

  • Prof. Cor Claeys

    Conference Co-Chair

  • Dr. Steve X. Liang

    Conference Co-Chair

  • Dr. Qinghuang Lin

    Conference Co-Chair

Keynote Speakers More

Driving Moore's Law into the Next Decade

Dr. Martin van den Brink

President and Chief Technology Officer, ASML

View

Micro-Fabrication Equipment, the Foundation of Digital Revolution and Beyond

Dr. Gerald Yin

Chairman and CEO, AMEC

View

Advanced 3D Chiplet Packaging Technology and Manufacturing

Dr. Marvin Liao

Vice President, APTS, TSMC

View

An Innovative 3D HITOC 4F2 DRAM Architecture

Dr. Feng Hong

CEO, ICLeague Technology

View
Sponsors:
Organizers:
Co-Organizers:
Co-Sponsors:
Proceedings Publication:

Training Courses More

  • 80

    Development of CMOS Integrated Process

     Dr. Jiang Yan Professor, North China University of Technology, China

Parallel Symposiums

  • Symposium I: Device Engineering and Memory Technology
  • Symposium II: Lithography and Patterning
  • Symposium III: Dry & Wet Etch and Cleaning
  • Symposium IV: Thin Film, Plating and Process Integration
  • Symposium V: CMP and Post-Polish Cleaning
  • Symposium VI: Metrology, Reliability and Testing
  • Symposium VII: Packaging and Assembly
  • Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies
  • Symposium IX: Design and Automation of Circuits and Systems

Sponsor Video

[close]

© 2022 SEMI 云官网. All Rights Reserved.